Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias

Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction

Strain measurements are demonstrated for through-silicon vias (TSVs) using synchrotron x-ray diffraction to characterize the effect of copper via dimensions and liner materials. Reduction in strains in the silicon around TSVs is observed for the TSVs with smaller via diameters and the TSVs with a thicker polymer liner. To interpret the measured two-dimensional (2D) TSV strain distribution maps ...

In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation

The Effects of Martensite Thermomechanical Parameters on the Formation of Nano/Ultrafine Grained Structure in 201LN Stainless Steel

In this study, the effects cold rolling and annealing parameters during thermomechanical processing of the AISI 201LN stainless steel were investigated. The cast samples were homogenized, hot-rolled and solution-annealed to acquire a suitable microstructure for the subsequent thermomechanical treatment. Unidirectional and transverse multi-pass cold rolling at 25, 0 and -15 °C was carried out to...

Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration

Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause reliability problems. In this study, the thermal stress in the TSV structure was measured by the wafer curvature method and its unique stress charact...

Analysis of x - ray diffraction as a probe of interdiffusion in Si / SiGe heterostructures

Analysis of x-ray diffraction as a probe of interdiffusion in Si/SiGe heterostructures D.B. Aubertine, N. Ozguven, and P.C. McIntyre Department of Materials Science and Engineering Stanford University, Stanford, CA S. Brennan Stanford Synchrotron Radiation Laboratory Stanford Linear Accelerator Center, Stanford, CA We investigate numerical simulations that utilize a non-linear interdiffusion so...